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Antistatic Material

Semiconductor-grade antistatic composite materials

PTFE (Teflon)–CNT (Carbon Nanotube) composite material designed to maximize the advantages of each component

  • Chemical resistance Heat resistance
  • Wear resistance Electrical conductivity★ (6 patents registered)
  • Product Details
    구분 BOWL CHUCK NOZZLE
    SPEC

    Top: 300Φ (OD) × 280Φ

    Bottom: 370Φ × 350Φ

    Height: 122 mm

    		 320Φ × 40 mm (H) 35Φ × 150 mm (H)
    Melting point 320~340°C
    Tensile strength (MPa) 18.1
    Compressive strength (MPa) 3.2
  • Common product information
    Common product information
    Gas Name Chemical Formula Purity Main Process Application Features / Remarks
    Hydrogen chloride (HCl) HCL 5N Etching process Wafer surface contaminant removal
    Chlorine Cl₂ 5N Metal etching (Al, W, etc.) Strong etching capability
    Fluorine F₂ 5N High-speed metal etching Highly toxic and explosive
    NF₃ NF₃ 4N CVD chamber cleaning process Generation of F after plasma dissociation
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